Full-Process Custom Socket Services
Local Technical Support in Taiwan
Offering a comprehensive portfolio of high-performance test sockets — including Burn-in Sockets, ATE Sockets, and Individual Temperature Control Sockets — supporting BGA, QFN, LGA, SOP, and all major package types. From design and simulation to mass production, Neoview delivers full turnkey solutionsunder one roof.
Core Advantages
Why Choose Our Socket Solutions
Full In-House Capability
Design, simulation, precision machining, assembly, board-level debugging, and mass production — all handled in-house with no outsourcing.
Fast Local Response in Taiwan
Direct access to Neoview’s Taiwan-based technical team eliminates intermediaries, ensuring the most accelerated response to evolving customer requirements.
Single-Point Quality Accountability
From design to delivery, quality is owned by a single responsible party — eliminating the defect risks that come with fragmented supplier chains.
Product Series
Three Core Socket Categories
For Burn-in / HTOL / HAST Testing
Supports clamshell, pull-rod, knob, and push-down clamping styles.
Heat spreaders and grounding copper blocks are available to match chip power requirements.
Sockets for Automated Test Equipment
Uses high-quality Japanese / Korean Pogo pins. Supports ambient, high-temperature, and low/high-temperature ATE testing with full signal simulation and verification.
Dedicated for HPB5C / LC2 Testers
Built-in heating rod and temperature sensor for independent per-socket thermal control. Maximum design power up to 160W.
Custom High-Pin-Count BGA Sockets
Custom-designed for high pin count requirements, supporting BGA2304 and above. Available with knob or lever-press clamping.
Supported Packages
Covering All Major IC Package Types
Process Capability
Complete Delivery Flow: Design to Mass Production
Mechanical Design
Thermal / Signal Simulation
Precision Machining
Precision Assembly
Board-Level Debug
Pilot & Mass Production
Simulation & Verification
Integrated Socket + IC + PCB Simulation Capability
Thermal Simulation
Matched simulation of heat spreader, heating rod, and per-chip power dissipation. Analyzes solder ball and Pogo pin temperature rise to prevent solder ball melting during high-power burn-in tests.
Signal Simulation
Full analysis covering insertion loss (S21), return loss (S11), TDR, and crosstalk, plus Socket signal simulation models — suitable for RF and high-frequency test requirements.
Technical Specifications
Common Specification Reference
| Specification | Details |
|---|---|
| Standard Lead Time | 4–5 weeks (includes design, machining, surface treatment, assembly, and QC) |
| Burn-in Socket Lifespan | Guaranteed 5 test cycles or 1 year (whichever comes first) |
| Pogo Pin Operating Temp. | SUS304 spring: -55°C ~ +150°C |
| Max. Current (sustained 2s) | 0.35 Pitch → 4.0A ｜ 0.4 Pitch → 6.0A ｜ 0.5 Pitch → 7.5A |
| Max. Design Power | Up to 160W (Individual Temp Control, HPB5C tester) |
| Measurement Equipment | Keyence IM-8005 Vision Measurement · Hexagon CMM Coordinate Measuring |
Need a Custom Socket Solution?
Submit your requirements and our sales team will get back to you within 2 business days
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